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Your search returned 23 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1997 Volume number : 20 Issue: 03 |
Vcsel Electrical Packaging Analysis And Design Guidelines For Multi-Ghz Applications
(Article)
Subject:
Electromagnetic Modeling
,
High Frequency
,
Signal Integrity
Author:
Stephen H.
Hall
Barry K.
Gilbert
Gregg J.
Fokken
page:
191
-
201
S Parameter-Based Experimental Modeling Of High Q Mcm Inductor With Exponential Gradient Learning Algorithm
(Article)
Subject:
Embedded
,
Experimental Modelling
,
Multichip Module
Author:
Jian
Zhao
Robert C.
Frye
K
Tai
page:
202
-
210
Wetting Interactions Between The Ni-Cu-P Deposit And In-Sn Solders
(Article)
Subject:
Activation Energy
,
Wetting
,
Solder Reliability
Author:
Chun-Jen
Chen
Kwang Lung
Lin
page:
211
-
216
Impedance And Crosstalk Of Stripline And Microstrip Transmission Lines
(Article)
Subject:
Balanced Ribs
,
Interconnect
,
Multichip Module
,
Unbalanced Conditions
Author:
A. J.
Rainal
page:
217
-
224
Highly Efficient Coupling Between Single-Mode Fiber And Polymer Optical Waveguides
(Article)
Subject:
Fiber Type
,
Transactions
,
Polymer Brush
,
Optical Couplers
Author:
Timothy S.
Barry
Daniel L.
Rode
Robert R.
Krchnavek
page:
225
-
228
Highly Efficient Coupling Between Single-Mode Fiber And Polymer Optical Waveguides
(Article)
Subject:
Fiber
,
Efficient Construction Management
,
Optical Couplers
Author:
Timothy S.
Barry
Robert R.
Krchnavek
Daniel L.
Rode
page:
225
-
228
Criteria For The Assessment Of Reliability Models
(Article)
Subject:
Assessment Checklist
,
Modeling
,
Reliability
Author:
Michael G.
Pecht
Anand A.
Shukla
A. G
Kelkar
page:
229
-
234
Fast Parameter Extraction For Multiconductor Interconnects In Multilayered Dielectric Media Using Mixture Method Of Equivalent Source And Measured Equation Of Invariance
(Article)
Subject:
Equivalent Power Storm
,
Interconnect
,
Multilayered Steel
Author:
Ronghong
Jin
Zhengfan
Li
Y
Gao
page:
235
-
240
Excimer Laser Machining And Metallization Of Vias In Aluminum Nitride
(Article)
Subject:
Ablation Zone
,
Ain
,
Excimer Laser Annealing
Author:
Janet K.
Lumpp
Susan D.
Allen
page:
241
-
246
Residual Stresses In Plastic Ic Packages During Surface Mounting Process Preceded By Moisture Soaking Test
(Article)
Subject:
Tsop
,
Time Dependence
,
Hygrothermal Analysis
Author:
Sung
Yi
Jinyu
Yang
Ji Cheng
Yang
page:
247
-
255
Low-Cost Fabrication Of Optical Subassemblies
(Article)
Subject:
Active Alignment
,
Computer -Aided Design
,
Fiber Optics
,
Plastic Spin
Author:
M
Cohen
G. A
Johnson
William K.
Hogan
page:
256
-
263
Measurement, Modeling, And Simulation Of Flip-Chip Cmos Asic Simultaneous Switching Noise On A Multilayer Ceramic Bga
(Article)
Subject:
Application Specific Integrated Circuits
,
Simultaneous Stron H Stabilization
,
Cmos Integrated Circuits
Author:
James P.
Libous
Daniel P.
Connor
page:
266
-
271
Measurement, Modeling, And Simulation Of Flip-Chip Cmos Asic Simultaneous Switching Noise On A Multilayer Ceramic Bga
(Article)
Subject:
Application Specific Integrated Circuits
,
Ceramic Ball
,
Cmos Integrated Circuits
,
Simultaneous Synchronized Evaluation
Author:
James P.
Libous
D. O
O'Connor
page:
266
-
271
Power Distribution Fidelity Of Wirebond Compared To Flip Chip Devices In Grid Array Packages
(Article)
Subject:
Flip Chip
,
Microprocessors
,
Pin -In-Socket
Author:
Hassan
Hashemi
Dennis J.
Herrell
page:
272
-
278
High Density Packaging Of X-Band Active Array Modules
(Article)
Subject:
Active Area
,
Aluminum Nitride
,
Flip Chip
Author:
Mark S.
Hauhe
John J.
Wooldridge
page:
279
-
291
Concrete Made With Recycled Glass Aggrates Mechanical Performance
(Article)
Subject:
Mechanical Performance
,
Recycled Glass Aggregates
,
Sustainability
Author:
D. N.
Serpanos
Jorge
Pontes
L. Da C
Brito
page:
29
-
38
Sso Noise Electrical Performance Limitations For Pqfp Packages
(Article)
Subject:
Electronic Packaging
,
Leadframes
,
Ssonoise
Author:
L
Lin
John L.
Prince
page:
292
-
297
Testability And Signal Integrity In A Low Cost Multichip Module
(Article)
Subject:
Electronic Packaging
,
Interconnects
,
Low Cost
,
Signal Integrity
Author:
Ahmed
Omer
Andrew
Flint
page:
300
-
307
Early Analysis Of Cost/Performance Trade-Offs In Mcm Systems
(Article)
Subject:
Advanced Packaging
,
Early Analysis
,
Mcm
Author:
Vivek
Garg
Darrell J.
Stogner
page:
308
-
319
Cost-Effective Multichip Module Manufacture Using Passive Substrate Fault Tolerance
(Article)
Subject:
Fault Tolerance
,
Multichip Modules
Author:
Christopher
Peacock
H
Bolouri
C. M.
Habiger
page:
320
-
326
Versatile Multilayer Mcm-D Structure For High Reliability Applications
(Article)
Subject:
Flip Chi P
,
Integrated Capital
,
Solder Bump Radius
Author:
Jan
Strandberg
Anders
Weiland
Peter
Bodo
page:
327
-
333
Performance Analysis Of Mcm Systems
(Article)
Subject:
Lossy And Lossless
,
Mcm
,
System Performance
,
Switching Netwoks
Author:
Claudio
Truzzi
Eric
Beyne
Edwin
Ringoot
page:
334
-
341
Effects Of Scanning And Biasing Circuit Restructuring On The Response Of A Large Area Magnetic Field Sensor Array
(Article)
Subject:
Magnetic Field
,
Restructuring
,
Sensor Arrays
Author:
Y
Audet
G. H.
Chapman
page:
342
-
348
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