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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging

Year : 1997 Volume number : 20 Issue: 03

Vcsel Electrical Packaging Analysis And Design Guidelines For Multi-Ghz Applications (Article)
Subject: Electromagnetic Modeling , High Frequency , Signal Integrity
Author: Stephen H. Hall      Barry K. Gilbert      Gregg J. Fokken     
page:      191 - 201
S Parameter-Based Experimental Modeling Of High Q Mcm Inductor With Exponential Gradient Learning Algorithm (Article)
Subject: Embedded , Experimental Modelling , Multichip Module
Author: Jian Zhao      Robert C. Frye      K Tai     
page:      202 - 210
Wetting Interactions Between The Ni-Cu-P Deposit And In-Sn Solders (Article)
Subject: Activation Energy , Wetting , Solder Reliability
Author: Chun-Jen Chen      Kwang Lung Lin     
page:      211 - 216
Impedance And Crosstalk Of Stripline And Microstrip Transmission Lines (Article)
Subject: Balanced Ribs , Interconnect , Multichip Module , Unbalanced Conditions
Author: A. J. Rainal     
page:      217 - 224
Highly Efficient Coupling Between Single-Mode Fiber And Polymer Optical Waveguides (Article)
Subject: Fiber Type , Transactions , Polymer Brush , Optical Couplers
Author: Timothy S. Barry      Daniel L. Rode      Robert R. Krchnavek     
page:      225 - 228
Highly Efficient Coupling Between Single-Mode Fiber And Polymer Optical Waveguides (Article)
Subject: Fiber , Efficient Construction Management , Optical Couplers
Author: Timothy S. Barry      Robert R. Krchnavek      Daniel L. Rode     
page:      225 - 228
Criteria For The Assessment Of Reliability Models (Article)
Subject: Assessment Checklist , Modeling , Reliability
Author: Michael G. Pecht      Anand A. Shukla      A. G Kelkar     
page:      229 - 234
Fast Parameter Extraction For Multiconductor Interconnects In Multilayered Dielectric Media Using Mixture Method Of Equivalent Source And Measured Equation Of Invariance (Article)
Subject: Equivalent Power Storm , Interconnect , Multilayered Steel
Author: Ronghong Jin      Zhengfan Li      Y Gao     
page:      235 - 240
Excimer Laser Machining And Metallization Of Vias In Aluminum Nitride (Article)
Subject: Ablation Zone , Ain , Excimer Laser Annealing
Author: Janet K. Lumpp      Susan D. Allen     
page:      241 - 246
Residual Stresses In Plastic Ic Packages During Surface Mounting Process Preceded By Moisture Soaking Test (Article)
Subject: Tsop , Time Dependence , Hygrothermal Analysis
Author: Sung Yi      Jinyu Yang      Ji Cheng Yang     
page:      247 - 255
Low-Cost Fabrication Of Optical Subassemblies (Article)
Subject: Active Alignment , Computer -Aided Design , Fiber Optics , Plastic Spin
Author: M Cohen      G. A Johnson      William K. Hogan     
page:      256 - 263
Measurement, Modeling, And Simulation Of Flip-Chip Cmos Asic Simultaneous Switching Noise On A Multilayer Ceramic Bga (Article)
Subject: Application Specific Integrated Circuits , Simultaneous Stron H Stabilization , Cmos Integrated Circuits
Author: James P. Libous      Daniel P. Connor     
page:      266 - 271
Measurement, Modeling, And Simulation Of Flip-Chip Cmos Asic Simultaneous Switching Noise On A Multilayer Ceramic Bga (Article)
Subject: Application Specific Integrated Circuits , Ceramic Ball , Cmos Integrated Circuits , Simultaneous Synchronized Evaluation
Author: James P. Libous      D. O O'Connor     
page:      266 - 271
Power Distribution Fidelity Of Wirebond Compared To Flip Chip Devices In Grid Array Packages (Article)
Subject: Flip Chip , Microprocessors , Pin -In-Socket
Author: Hassan Hashemi      Dennis J. Herrell     
page:      272 - 278
High Density Packaging Of X-Band Active Array Modules (Article)
Subject: Active Area , Aluminum Nitride , Flip Chip
Author: Mark S. Hauhe      John J. Wooldridge     
page:      279 - 291
Concrete Made With Recycled Glass Aggrates Mechanical Performance (Article)
Subject: Mechanical Performance , Recycled Glass Aggregates , Sustainability
Author: D. N. Serpanos      Jorge Pontes      L. Da C Brito     
page:      29 - 38
Sso Noise Electrical Performance Limitations For Pqfp Packages (Article)
Subject: Electronic Packaging , Leadframes , Ssonoise
Author: L Lin      John L. Prince     
page:      292 - 297
Testability And Signal Integrity In A Low Cost Multichip Module (Article)
Subject: Electronic Packaging , Interconnects , Low Cost , Signal Integrity
Author: Ahmed Omer      Andrew Flint     
page:      300 - 307
Early Analysis Of Cost/Performance Trade-Offs In Mcm Systems (Article)
Subject: Advanced Packaging , Early Analysis , Mcm
Author: Vivek Garg      Darrell J. Stogner     
page:      308 - 319
Cost-Effective Multichip Module Manufacture Using Passive Substrate Fault Tolerance (Article)
Subject: Fault Tolerance , Multichip Modules
Author: Christopher Peacock      H Bolouri      C. M. Habiger     
page:      320 - 326
Versatile Multilayer Mcm-D Structure For High Reliability Applications (Article)
Subject: Flip Chi P , Integrated Capital , Solder Bump Radius
Author: Jan Strandberg      Anders Weiland      Peter Bodo     
page:      327 - 333
Performance Analysis Of Mcm Systems (Article)
Subject: Lossy And Lossless , Mcm , System Performance , Switching Netwoks
Author: Claudio Truzzi      Eric Beyne      Edwin Ringoot     
page:      334 - 341
Effects Of Scanning And Biasing Circuit Restructuring On The Response Of A Large Area Magnetic Field Sensor Array (Article)
Subject: Magnetic Field , Restructuring , Sensor Arrays
Author: Y Audet      G. H. Chapman     
page:      342 - 348